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键合丝(铝线、铝带)
焊锡丝、焊带

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SPM在合金焊料方面也有着多年的研发和生产应用经验,类似于普通的铅锡合金焊料到新兴的无铅焊料,还有一些应用于大功率组装方面的焊带等,SPM都可以配合客户开发及生产所需的产品。
我们可提供一系列规格的焊锡丝及以纯金或各种金属为基材的焊带,品质出色,在国内已拥有众多客户
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应用于光前方面的焊片,及其它器件组装方面所需的散热片,焊盘等合金产品。
金线

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铜线是一种半导体封装中的新型材料,可替代昂贵的金线,大大节约生产成本,目前已在市场上广泛地使用。
铜线与金线之间直径的换算如下: (d:直径,s:导电率)
其中 sCu=103.1%IACS , sAu=73.4%IACS



由于目前大多数半导体封装制造企业对成本的考虑越来越多,加上铜线比现在普遍使用的金线的某些物理特性及电性能方面都要更好(表1)。所以铜线代替金线在半导体封装的应用开始慢慢成为趋势。SPM在铜线研发和制造方面都有着较强的优势,目前SPM能够制造0.7mil---10mil的各种规格的铜线,并能够根据客户的产品和应用一起帮助客户研发和制造适合的产品。

性能 Cu Au Al Ag
电导率 103.1 73.4 64.5 108.4
电阻率 16.7 20.1 16.7 14.7
热导率 398.0 317.9 243.0 428.0
热膨胀系数 16.5 14.2 23.6 19.0
弹性模量 115 78 62 71

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随着大功率器件及分立器件的市场迅速发展,粗铝线的应用也变得越来越广泛。SPM在粗铝线制造方面有着丰富的经验。目前,有相当的国际和国内客户已经在成熟的使用SPM铝线。在整个铝线制造方面,SPM目前可以提供从0.7mil开始的细铝线到20mil左右的粗铝线的各种成分的全规格,硬度和成分都可以根据客户的要求来定制。
细硅铝线 线径有0.8mil,1.0mil,1.25mil,2mil
粗铝线 包括5/9's, 4/9’s, 0.5%Mg Al, 线径有4mil, 5mil, 6mil, 7mil, 8mil, 12mil, 20mil